Stress-engineered MEMS

Details

Event Seminar at Stanford

Authors

Technical Publications
October 27th 2008
After a little introduction to PARC, I'll describe how we've been using designed stress gradients (GPa/um) to make a variety of micro-devices. The focus has been on spring based electrical interconnects for electronics packaging. We'll describe various package test vehicles we've built and tested with micrometer scale structures (smaller and more compliant than other approaches). I'll also describe a high Q RF MEMS coil and other work devices we've demonstrated based on this technology.

Citation

Chow, E. M.; De Bruyker, D.; Chua, C. L.; Peeters, E. Stress-engineered MEMS. Engineering Seminar at Stanford University; 2008 October 27; Stanford, CA.

Additional information

Focus Areas

Our work is centered around a series of Focus Areas that we believe are the future of science and technology.

FIND OUT MORE
Licensing & Commercialization Opportunities

We’re continually developing new technologies, many of which are available for¬†Commercialization.

FIND OUT MORE
News

PARC scientists and staffers are active members and contributors to the science and technology communities.

FIND OUT MORE