Stress-engineered MEMS

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Event Seminar at Stanford

Authors

Technical Publications
October 27th 2008
After a little introduction to PARC, I'll describe how we've been using designed stress gradients (GPa/um) to make a variety of micro-devices. The focus has been on spring based electrical interconnects for electronics packaging. We'll describe various package test vehicles we've built and tested with micrometer scale structures (smaller and more compliant than other approaches). I'll also describe a high Q RF MEMS coil and other work devices we've demonstrated based on this technology.

Citation

Chow, E. M.; De Bruyker, D.; Chua, C. L.; Peeters, E. Stress-engineered MEMS. Engineering Seminar at Stanford University; 2008 October 27; Stanford, CA.

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