The interplay of materials in printed electronics

Details

Event MRSFall 2008 proceedings

Authors

Daniel, Jurgen H.
Ana Claudia Arias
Beverly Russo
Sambandan, Sanjiv
Tse Nga Ng
Street, Robert A.
Krusor, Brent S.
Technical Publications
December 17th 2008
The fabrication of electronic circuits using printing methods carries many promises such as low cost and large-area manufacturing capability. However, a variety of new materials is introduced and these have to work together in order to be compatible with the overall processing steps and to deliver good device performance. Here some of the aspects related to the gate dielectrics are discussed and device applications of printed electronics are presented.

Citation

Daniel, J. H.; Arias, A. C.; Russo, B.; Sambandan, S.; Ng, T.; Street, R. A.; Krusor, B. S. The interplay of materials in printed electronics. Proceedings of the MRS Fall 2008 Meeting; 2008 December 1-5; Boston, MA.

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