Transient electronics based on frangible stress-engineered glass substrates

Details

Event Government Microcircuit Applications & Critical Technology Conference (GomacTech)
Technical Publications
March 20th 2017
We present an approach to transience electronics where transience is achieved by fracturing electronic components into small pieces and widely dispersing the fragments over a large area. The approach is based on chemically tempering a thin glass substrate to induce large compressive stresses on the glass surface. The tempered glass is strong and stable, but rapidly disintegrates into small fragments if damaged. When triggered, stored strain energy is released, and electronic components disposed on the glass substrate is fractured together with the glass.

Citation

Chua, C. L.; Limb, S.; Whiting, G.; Garner, S.; Lu, J. P.; Chang, N. Transient electronics based on frangible stress-engineered glass substrates. Government Microcircuit Applications & Critical Technology Conference (GomacTech).; Reno, NV USA. Date of Talk: 2017-03-20

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