Eugene's work has covered the areas of microelectromechanical systems (MEMS), packaging and printing. Currently, he is focused on multiple application areas, including: microsprings for integrated circuit packaging and testing; novel viscous liquid printing concepts; and xerographic micro-chip assembly.
Eugene has also worked on thin film transistor integration with MEMS as well as large area printed organic electronics. Prior to coming to PARC, he developed through wafer electrical interconnects in silicon, 2d arrays of atomic force piezoresistive cantilevers, and deep plasma etching techniques.
Dr. Eugene Chow earned his Ph.D. and M.S. in electrical engineering from Stanford University, along with an M.S. in management science and engineering. He received his B.S. in engineering physics from the University of California, Berkeley. He has over 15 issued patents and 40 journal and conference publications.
In his free time, Eugene used to play a lot of golf and tennis -- but he's now busy chasing a little toddler.
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in the news view all
Next Trick for Laser Printers: Manufacturing Electronics
9 April 2013 | Techonomy
Tiny Chiplets: A New Level of Micro Manufacturing
8 April 2013 | The New York Times
Tiny Springs Could Reduce Microchip Waste
13 July 2010 | Technology Review
news releases view all
events view all
Ballistic Aerosol Marking
16 June 2013
Integrating Through-Silicon Vias with Solder Free, Compliant Interconnects for Novel, Large Area Interposers
29 May 2012 | San Diego, CA
Heterogeneous Integration with Microsprings
17 April 2012 | Arlington , DC