PROFILE:
Eugene Chow
Eugene's work has covered the areas of microelectromechanical systems (MEMS), packaging and printing. Currently, he is focused on multiple application areas, including: microsprings for integrated circuit packaging and testing; novel viscous liquid printing concepts; and xerographic micro-chip assembly.
Eugene has also worked on thin film transistor integration with MEMS as well as large area printed organic electronics. Prior to coming to PARC, he developed through wafer electrical interconnects in silicon, 2d arrays of atomic force piezoresistive cantilevers, and deep plasma etching techniques.
Dr. Eugene Chow earned his Ph.D. and M.S. in electrical engineering from Stanford University, along with an M.S. in management science and engineering. He received his B.S. in engineering physics from the University of California, Berkeley. He has over 15 issued patents and 40 journal and conference publications.
In his free time, Eugene used to play a lot of golf and tennis -- but he's now busy chasing a little toddler.
PARC publications
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2012
S-shaped double-spring structures for high stiffness and spring height
to be published in Microelectronic Engineering
21 April 2012
2011
S-shaped double-spring structures for high stiffness and spring height
37th International Conference on Micro and Nano Engineering
19 September 2011
Integration and packaging of a macrochip with silicon nanophotonic links
Invited paper for IEEE Journal of Selected Topics in Quantum Electronics
May 2011
2010
High current properties of a microspring contact for flip chip packaging
Hilton Head 2010
6 June 2010
2009
Microspring characterization and flip chip assembly reliability
Best Paper Award at IMAPS 2009
1 November 2009
Wafer level packaging with soldered stress engineered micro-springs
IEEE Transactions on Advanced Packaging
May 2009
2008
2006
Pressure contact micro-springs in small pitch flip-chip packages
IEEE Transactions on Components and Packaging Technologies
December 2006
Applied Physics Letters
2 October 2006
Intracellular calcium waves in bone cell networks under single cell nanoindentation
Molecular & Cellular Biomechanics
1 June 2006
2005
High voltage thin film transistors integrated with MEMS
Transducers '05, Digest of Technical Papers
5 June 2005
Solder-free pressure contact micro-springs in high-density flip-chip packages
55th Electronic Components and Technology Conference
31 May 2005
Chip on glass bonding using StressedMetal™ Technology
2005 SID International Symposium Digest of Technical Papers
24 May 2005
Proceedings of the Spring 2005 Materials Research Society Meeting
28 March 2005
2004
2003
12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers '03)
10 June 2003
Intermittency study of a stressed-metal micro-spring sliding electrical contact
Electronic Components and Technology Conference
29 May 2003
2002
Bent metal beams as probes for high-topography substrates in atomic force microscopy (AFM)
Micro- and Nanoengineering Conference 2002
16 September 2002
Scanning probes with tall tips for high aspect ratio MEMS metrology
Solid State Sensor, Actuator and Microsystems Workshop
2 June 2002
Scanning stressy probes - concept and use in atomic force microscopy
Scanning Probe Microscopy, Sensors and Nanostructures Conference 2002
26 May 2002
contact
related focus areas
related competencies
- large-area electronics
- semiconductors
- thin films
in the news
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Next Trick for Laser Printers: Manufacturing Electronics
9 April 2013 | Techonomy
Tiny Chiplets: A New Level of Micro Manufacturing
8 April 2013 | The New York Times
Tiny Springs Could Reduce Microchip Waste
13 July 2010 | Technology Review
news releases
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Samsung Fine Chemicals Chooses PARC to Validate Use of New Materials for Printed Displays
12 November 2012
PARC Named Runner-Up for The Wall Street Journal Technology Innovation Award
16 October 2012
events
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Ballistic Aerosol Marking
16 June 2013
Integrating Through-Silicon Vias with Solder Free, Compliant Interconnects for Novel, Large Area Interposers
29 May 2012 | San Diego, CA
Heterogeneous Integration with Microsprings
17 April 2012 | Arlington , DC