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PROFILE:

 

Eugene Chow

Eugene's work has covered the areas of microelectromechanical systems (MEMS), packaging and printing. Currently, he is focused on multiple application areas, including: microsprings for integrated circuit packaging and testing; novel viscous liquid printing concepts; and xerographic micro-chip assembly.

Eugene has also worked on thin film transistor integration with MEMS as well as large area printed organic electronics.  Prior to coming to PARC, he developed through wafer electrical interconnects in silicon, 2d arrays of atomic force piezoresistive cantilevers, and deep plasma etching techniques.

Dr. Eugene Chow earned his Ph.D. and M.S. in electrical engineering from Stanford University, along with an M.S. in management science and engineering. He received his B.S. in engineering physics from the University of California, Berkeley. He has over 60 issued patents and 40 journal and conference publications.

In his free time, Eugene used to play a lot of golf and tennis -- but he's now busy chasing a little toddler.

 

PARC publications

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2014

MicroArray Ballistic Drug Delivery

DNA Vaccines 2014

21 July 2014

2013

3D printed electronics

Digital Fabrication 2013

30 September 2013

Development of novel arrayed microjet devices for transdermal drug administration

40th Annual Meeting & Exposition of the Controlled Release Society

23 July 2013

Ballistic aerosol marking

17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2013)

19 June 2013

Microspring characterization and flip chip assembly reliability

IEEE Transactions on Components and Packaging Technologies

February 2013

2012

2011

S-shaped double-spring structures for high stiffness and spring height

37th International Conference on Micro and Nano Engineering

19 September 2011

Integration and packaging of a macrochip with silicon nanophotonic links

Invited paper for IEEE Journal of Selected Topics in Quantum Electronics

May 2011

2010

2009

Microspring characterization and flip chip assembly reliability

Best Paper Award at IMAPS 2009

1 November 2009

Wafer level packaging with soldered stress engineered micro-springs

IEEE Transactions on Advanced Packaging

May 2009

2008

Stress-engineered MEMS

Seminar at Stanford

1 January 2008

2006

Pressure contact micro-springs in small pitch flip-chip packages

IEEE Transactions on Components and Packaging Technologies

December 2006

High voltage thin film transistors integrated with MEMS

Sensors and Actuators A

1 January 2006

2005

Applications of stress-engineered MEMS

Stanford ME342 MEMS Seminar

13 July 2005

High voltage thin film transistors integrated with MEMS

Transducers '05, Digest of Technical Papers

5 June 2005

Solder-free pressure contact micro-springs in high-density flip-chip packages

55th Electronic Components and Technology Conference

31 May 2005

Chip on glass bonding using StressedMetal™ Technology

2005 SID International Symposium Digest of Technical Papers

24 May 2005

Fine-feature patterning of giant-area flexible electronics by microcontact printing and digital lithography

Proceedings of the Spring 2005 Materials Research Society Meeting

28 March 2005

2004

Applications of stress-engineered MEMS

Bay Area MEMS Journal Club

11 November 2004

2003

Stressed-metal NiZr probes for atomic force microscopy

Microelectronic Engineering

June 2003

Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology

12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers '03)

10 June 2003

Intermittency study of a stressed-metal micro-spring sliding electrical contact

Electronic Components and Technology Conference

29 May 2003

2002

Stressed metal probes for atomic force microscopy

Applied Physics Letters

14 October 2002

Bent metal beams as probes for high-topography substrates in atomic force microscopy (AFM)

Micro- and Nanoengineering Conference 2002

16 September 2002

Scanning probes with tall tips for high aspect ratio MEMS metrology

Solid State Sensor, Actuator and Microsystems Workshop

2 June 2002

Scanning stressy probes - concept and use in atomic force microscopy

Scanning Probe Microscopy, Sensors and Nanostructures Conference 2002

26 May 2002